Assessment of Ni/Pd/Au-Pd and Ni/Pd/Au-Ag Pre-plated Leadframe Packages Subject to Electrochemical Migration and Mixed Flowing Gas Tests
نویسندگان
چکیده
Pre-plated leadframes packages with a new noble metal finish type were exposed to various electrochemical migration tests, and mixed flowing gas environments to assess the quality and reliability due to these environmental conditions. Packages were tested as discrete parts and also as parts mounted onto printed circuit boards to assess the effect of reflow soldering. Selected packages with SnPb plated leadframes were tested for comparison purposes. After test exposure, optical microscopy, SEM and EDS analyses were conducted to evaluate the corrosion behavior. Corrosion and creep corrosion on the leads were observed on all the pre-plated test samples subject to the mixed flowing gas. Creep corrosion over the mold compound surface was identified on the un-mounted QFN packages. The creep corrosion products were found to be electrically conductive and could bridge adjacent lead pairs.
منابع مشابه
THE EFFECT OF DELAMINATION BETWEEN MOLD COMPOUND AND Ni/Pd/Au LEADFRAME ON QFN PACKAGE
The susceptibility of QFN package to delamination, particularly in the area between the Ni/Pd/Au leadframe die pad and mold compound, has been a major concern to many IC manufacturers. The presence of a Ni/Pd/Au oxide layer on the leadframe of QFN packages was found to cause delamination at the die pad or mold compound interface. Delamination refers to the disbonding between a surface of the mo...
متن کاملLead-Free Soldering – Where The World Is Going
Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...
متن کاملCharacterization of Pd/Ni/Au ohmic contacts on p-GaN
A low-resistance ohmic contact to Mg-doped p-type GaN grown by metal-organic chemical vapor deposition (MOCVD) with a carrier concentration of 2 · 10 cm 3 using Pd/Ni/Au metallization was formed. An anneal at 500 C for 1 min in a flowing N2 ambient produced an excellent ohmic contact with a specific contact resistivity as low as 2.4 · 10 5 X cm. X-ray photoelectron spectroscopy (XPS) and Auger ...
متن کاملEffect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds
A 0.3-lm-thick electrolytic Pd layer was plated on 1 lm of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values (Ra) of 0.08 lm and 0.5 lm, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was optimized, and the electrical reliability was investigated under a high temperature storage test (HTST) during 8...
متن کاملApplication of Pd-Substituted Ni-Al Layered Double Hydroxides for the Hydrogen Evolution Reaction
Clean production of hydrogen from electrochemical water splitting has been known as a green method of fuel production. In this work, electrocatalytic hydrogen evolution reaction (HER) was investigated at new prepared layered double hydroxides (LDH) in acidic solution. NiAl/carbon black (CB) LDH was monitored using x-ray diffraction (XRD), Fourier transform infrared (FT-IR) spectroscopy, scannin...
متن کامل